Cixi Intec Import And Export Co., Ltd.

830 tie point solderless breadboard

830 tie point solderless breadboard
Product Detailed

830 tie point
white
solderless breadboard
recycle use
twin adhesive back, could be fix and remove to any position easily

white 830 tie point solderless breadboard 

 

white & transparent available 

recycle use

twin adhesive back, could be fix and remove to any position easily

 

contact resistance: 100mΩ max

insulator resistance: 1000MΩmin. @DC 500V

dielectric withstanding voltage: AC 500V for 1 minute

operating temperature: -20oC~+80oC

 

housing material: ABS

contact maerial: copper alloy nickel palted

contact way:spring clip

connector type: socket

plug times: ≥10000 times

 

housing size( L*W*H): 165mm*54mm*8.35mm

pitch=2.54mm  /  0.1''

 

all material Rohs compliance

 

The following picture for details :

 

 

 

 

 

 



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