170 tie point mini solderless breadboard

170 tie point
mini type
solderless breadboard
recycle use
twin adhesive back, could be fix and remove to any position

170 tie point solderless breadboard

 

slot inside

mini type, recycle use

twin adhesive back, could be fix and remove to any position easily

contact resistance: 100mΩ max

insulator resistance: 1000MΩmin. @DC 500V

dielectric withstanding voltage: AC 500V for 1 minute

operating temperature: -20oC~+80oC

housing material: ABS

contact maerial: copper alloy nickel palted

contact way:spring clip

connector type: socket

plug times: ≥10000 times

housing size( L*W*H): 34.5mm*45.5mm*8.35mm

pitch=2.54mm  /  0.1''

house color: white black red green blue transparent available

all material Rohs compliance